Key Features

• Single ~ Multi Layer PCB Design ( 1~ 68 layers)
• SI, PI 3D Simulation Based PCB Design
• PCB Design for Mass Production and Global Certification Compliance
  (KC, CE, UL, FCC)
• High-Speed(~30GHz) PCB Design Using SI/PI Analysis
• Fine Trace Width (15um) Design
• BGA 0.3~0.35mm Pitch Stack Via Build-Up PCB Design
• Multi-Impedance Control PCB Design
• Semiconductor Test PCB & Wafer package Substrate Design